Company Overview

Vision:
　　　　Our vision is to be a best foundry partner of miniature key components in 3C industries.

Mission:
　　　　AFSC try to introduce the semiconductor process into miniature key components in 3C industries. Such as flip chip substrate, IPD device, high power LED package substrate foundry service to meet the demands for "miniature" and "high frequency" passive components, integrated passive devices - passive IC.

Preface
　　　　AFSC was established in July 2004 at Tainan Science-Based Industrial Park, Taiwan, AFSC transfer the furnace technology from Japan and became a furnace maker in Taiwan.
AFSC set up the foundry line from the beginning of 2005 by customer request. AFSC introduce the semiconductor process into miniature key components in 3C industries to meet the demands for "miniature" and "high frequency" passive components, integrated passive devices - passive IC foundry.
We also can provide the metallization for glass wafer and ceramic substrate.
ASFC is a profession foundry Factory.

ASFC is your reliable IPD, MEMS, Metallization foundry partner!