AFS
Furnace advantage
Outstanding performance, reduced manufacturing
costs and improved overall yields
- A small footprint saves up to
30% of clean room space
- Superior process uniformity
- Stable control system and user
friendly operation interface
- Energy saving
AFS
Horizontal furnace configuration
AFS furnace offers great value to
the small, medium and large silicon
wafer manufacturer.
The systems are available in various
sizes and configuration as described
in the table below.
AFS furnace
applications
AFS Furnace systems
can be used for all AP and LPCVD processes
employed in the semiconductor industry,
including:
- Dry and wet thermal
Oxides
- Drive in diffusion
furnace
- Alloy anneal
furnace
- LPCVD Low Stress
Poly-Silicon Films
- LPCVD System
for Low Strain Si3N4 Films
- HTO films deposition
- LTO films deposition
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