Machine: DNS DA-60A Application: Photo resist coating
• Substrate size: 6"
• Coating of Positive resists : 10 μm to 25 μm.
• Coating of positive resists, including soft bake.
• Uniformity: < ± 5% within wafer
• Capacity: 10k pieces/month
◆6" wafer Automatic P.R. developing track
Machine: DNS DA-60A
Application: P.R. developing
• Substrate size: 6"
• Development of positive resists, including hard bake.
• Coating of positive resists, including soft bake.
• Uniformity: < ± 5% within wafer
• Capacity: 10k pieces/month
◆Automatic low k material coating line
Machine: DNS SKW-636 Application: Low k material coating
• Substrate size: 6”
• Coating material: P.I. or BCB.
• Coating of ILD : 3 μm to 10 μm.
• Coating of ILD, including developer.
• Uniformity: < ± 5% within wafer
• Capacity: 10k pieces/month
