RANGE OF NEW EQUIPMENT AVAILABLE:
‧
944 in line Sputter systems
‧ ELAS in line Sputter systems
‧ R&D Sputter systems
‧ Used MRC sputter systems
944 in line
Sputter systems
Main features:
‧ Dual level load lock
‧ CTI 10” cryo pump on chamber as standard.
‧ CTI 8” cryo, turbo pump or rotary pump available on
load lock.
‧ RF etch station as standard.
‧ The 944 can be used with a variety of different substrates.
‧ The 944 can be used with a variety of different materials.
‧ Fully automated process control.
‧ The system has been designed by maintenance engineers
to make the system easy for maintenance .
‧ Many software features added to make system set-up
easy.
ELAS
in line Sputter systems
Main features:
‧ Dual level load lock
‧ CTI 10” cryo pump on chamber as standard.
‧ CTI 8” cryo, turbo pump or rotary pump available on
load lock.
‧ 3 Target plus RF etch station as standard.
‧ Dual level load lock.
‧ Through wall mounting for very small cleanroom footprint.
‧ Large area substrate.
‧ Up to 400mm X 420mm
‧ 4 pieces 200mm WAFERS
‧ 6 pieces 150mm WAFERS
‧ Cassette to Cassette operation for 4”, 6” and 8” wafers.
Using industry standard Brooks robot system.
R &D Sputter
systems
Main features:
‧ Load lock system.
‧ Multi target system.
‧ Co sput of up to three materials (RF or DC) plus substrate
bias.
‧ RF Etch station in load lock
‧ 8” substrates.
‧ Full recipe control.
‧ System can be configured to meet customers individual
requirements.
‧ If it requires a vacuum and a plasma ESC will try
to help you configure a system.
Used MRC Sputter
systems:
MRC 602,603
MRC 902,903
MRC 943
Main features:
‧ Dual level load lock
‧ CTI 8” cryo pump on chamber as standard.
‧ Rotary pump available on load lock.
‧ RF etch station as standard.
‧ The 903 can be used with a variety of different substrates.
‧ The 903 can be used with a variety of different materials.
‧ Semi-auto process control.
‧ The system has been designed by maintenance engineers
to make the system easy for maintenance ..
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