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Redistribution Layer
.Integrated passive devices
Customized MEMS devices
.RF passive devices
SMD Pad electrode processes
.ENIG plating



   

 

 

 
 
 
Integrated passive devices, IPDs
 

Low Cost 6" Silicon process
High Performance Multi-Layer Process
MMIC based design a processing yields Extreme Repeatability

Application products :

1. RF Monolithic Passive Devices
  • Band pass filter
  • 90 Degree Hybrids
  • Power dividers
  • Directional Couplers
  • Fixed Attenuators
2.Integrated RF module
  • Voltage Variable Attenuators
  • Transceiver & Receiver module substrate (including BPF, balun…)
  • Customized Passive Networks



Process flow:


Main Parameter Overview :


Please contact us for detail and design manual.

 
 
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●Advanced Furnace Systems Corp.
●SOUTHERN TAIWNA SCENCE PARK
●Add : 3F.-2, No.19, Nanke 3rd Rd., Sinshih Township, Tainan County 744, Taiwan (R.O.C.)
●E-mail: cmchu.afs@msa.hinet.net
●Tel : +886-6-505-3705 Ext : 10
●Fax :+886-6-505-3711