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．Redistribution Layer
．Integrated passive devices
．Customized MEMS devices
．RF passive devices
．SMD Pad electrode processes
．ENIG plating



   

 

 
 
 
 
 
RF passive devices
AFSC can provide customized process on Si wafer or ceramic wafer.

The processes including:
1.Lithography technology.
2.Thin film deposition.
3.Wet & Dry etching
4.Electro plating
5.Low k dielectric process
6.Electro-less plating process.

Application products:

1. Network resistor
2. RF Network LC filter
3. RF Chip C
4. RF inductor
 
 
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●Advanced Furnace Systems Corp.
●SOUTHERN TAIWNA SCENCE PARK
●Add : 3F.-2, No.19, Nanke 3rd Rd., Sinshih Township, Tainan County 744, Taiwan (R.O.C.)
●E-mail: cmchu.afs@msa.hinet.net
●Tel : +886-6-505-3705 Ext : 10
●Fax :+886-6-505-3711