．Lithography processes ．Wet chemical processes ．Thin film processes ．Dry etching processeses ．Metrology tools     Wet chemical Processes ◆ Single wafer wet etcher Machine: DNS SPW812 Application: Metal etching •Substrate size: 6”. •Capacity: 10k pieces/month ◆ Electrical platter Machine: Cu platter Application: Cu plating •Substrate size: 6”. •High uniformity Cu plating was achieved. •EP thickness: 5um~10um •Uniformity < ± 10% (Thickness 10um) •Capacity: 10k pieces/month ◆ P.R. stripper Machine: Kaijo bocket cleaner Application: P.R. stripping •Substrate size: 6". •Capacity: 10k pieces/month ◆ Wafer Scrubber Machine:DNS 629 scrubber Application: Wafer surface cleaning •Substrate size: 6". •Bruch clean •High pressure D.I. beam clean •Capacity: 10k pieces/month ◆ Electro-less plating systems Machine: ENIG platter Application: 1.Ni(2.5~6um)/ Fresh Gold(0.05~0.1um) electro-less plating 2.Ni(2.5~6um)/ Thick Gold(0.4~0.5um) electro-less plating 3.Ni(2.5~6um)/ Pd(0.1~0.3um) /Fresh Gold(0.05~0.1um) electro-less plating •High uniformity and high stability electro-less plating was achieved. •Ni/Au on Ag, Ag-Pt, Ag-Pd, Cu were achieved. •Substrate type: Si, Glass, Ceramic, LTCC substrate. •Uniformity < ± 10% •Capacity: 10k pieces/month         ●Advanced Furnace Systems Corp. ●SOUTHERN TAIWNA SCENCE PARK ●Add : 3F.-2, No.19, Nanke 3rd Rd., Sinshih Township, Tainan County 744, Taiwan (R.O.C.) ●E-mail: cmchu.afs@msa.hinet.net ●Tel : +886-6-505-3705 Ext : 10 ●Fax :+886-6-505-3711