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Lithography processes
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Wet chemical processes
Wet chemical Processes
◆ Wafer Scrubber
Machine:DNS 629 scrubber
Application: Wafer surface cleaning
•Substrate size: 6".
•Bruch clean
•High pressure D.I. beam clean
•Capacity: 10k pieces/month
●Advanced Furnace Systems Corp.
●SOUTHERN TAIWNA SCENCE PARK
●Add : 3F.-2, No.19, Nanke 3rd Rd., Sinshih Township, Tainan County 744, Taiwan (R.O.C.)
●E-mail:
cmchu.afs@msa.hinet.net
●Tel : +886-6-505-3705 Ext : 10
●Fax :+886-6-505-3711