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  Lithography processes
Wet chemical processes
Thin film processes
Dry etching processeses
Metrology tools

 

 

 
 
 
Thin Film technologies

◆ Batch type PECVD Systems :
Machine: ASM batch PECVD
Application: Low stress Nitride, Oxide
• Substrate size: 6”.
• Uniformity < ± 10%
• Capacity: 10k pieces/month

Single wafer type PECVD Systems :
Machine: AMAT P5000 PECVD
Application: PE Nitride, TEOS Oxide
• Substrate size: 6”.
• High uniformity SiN and oxide was achieved.
• Uniformity < ± 2% (@Thickness 20nm)
• Capacity: 10k pieces/month

LPCVD Systems :
Machine: TEL LPCVD
Application: Nitride, low stress SiN
• Substrate size: 6”.
• High uniformity SiN was achieved.
• Uniformity < ± 5% (@Thickness 20nm)
• Capacity: 10k pieces/month

Thermal oxide Systems :
Machine: AFS oxidation furnace
Application: Dry thermal oxide
• Substrate size: 6”.
• Uniformity < ± 5% (@Thickness 20nm)
• Capacity: 10k pieces/month

Low pressure Furnace systems :
Machine: AFS LP Curing furnace
Application: P.I., BCB curing
• AFS vacuum furnace for ILD curing
• Temperature: 100 ~450 degree C
• Vacuum : 5 x 10-5 torr
• Gas: N2
• Capacity: 10k pieces/month

◆ Cluster Single wafer sputter Systems :
Machine: CVC cluster sputter systems
Application: TaN 、TiW、Ta2O5、Ta、NiCr
•Substrate size: 6".
•Pre-sputter of RF back etching capability.
•Reactive sputter capability.
•Substrate Heating (up to 300℃) capability.
•Continue multi layer process capability.
•Uniformity < ± 5% (@Thickness 20nm)
•Capacity: 10k pieces/month

◆ Batch type sputter Systems :
Machine: MRC643 Vertical sputter systems
Application: CrSi、AL
• Substrate size: 6".
• Pre-sputter of RF back etching capability.
•Continue multi layer process capability.
• Uniformity < ± 7%
• Capacity: 10k pieces/month

Batch sputter Systems :
Machine: Fulintec Vertical sputter systems
Application: Ti、Cu
•Substrate size: 6" or 8".
•Pre-sputter of RF back etching capability.
•Continue multi layer process capability.
•Uniformity < ± 10%
•Capacity: 30k pieces/month

◆ E-beam deposition Systems :
Machine: CHA e-beam deposition systems.
Application: Ti、Cu、Ni、Au multilayer
• Substrate size: 6"
• Vacuum: 5 x10-7 torr
• Continue multi layer process capability.
• Uniformity < ± 10%
• Capacity: 3k pieces/month

 
 
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●Advanced Furnace Systems Corp.
●SOUTHERN TAIWNA SCENCE PARK
●Add : 3F.-2, No.19, Nanke 3rd Rd., Sinshih Township, Tainan County 744, Taiwan (R.O.C.)
●E-mail: cmchu.afs@msa.hinet.net
●Tel : +886-6-505-3705 Ext : 10
●Fax :+886-6-505-3711