．Lithography processes ．Wet chemical processes ．Thin film processes ．Dry etching processeses ．Metrology tools       Dry etching Technologies ◆ Reactive Ion etching Systems Machine: ULVC 3000 dry etcher Gas system: SF6, CF4 Application: • Silicon oxide etch • Silicon nitride etch • Polymer discumm ◆ ICP Si Deep RIE Systems Machine: STS ICP etcher Gas system: SF6, C4F8, Ar, O2 Application: • Deep Silicon etch • Bosch process ◆ P.R. Asher systems Machine: B.C. Asher Gas system: N2, O2 Application: • P.R. asher       ●Advanced Furnace Systems Corp. ●SOUTHERN TAIWNA SCENCE PARK ●Add : 3F.-2, No.19, Nanke 3rd Rd., Sinshih Township, Tainan County 744, Taiwan (R.O.C.) ●E-mail: cmchu.afs@msa.hinet.net ●Tel : +886-6-505-3705 Ext : 10 ●Fax :+886-6-505-3711